MIL-STD-810G and GJB150.10 A-2009 Equipment Laboratory Environmental Test Method.

The purpose of the mold test is to assess the degree of mold growth on equipment and the degree of impact of mold growth on equipment performance or use. 

The mold test is mainly used for: 

Determine whether the equipment or components are mildewed;

The rate of mold growth on the equipment;

The impact of mold growth on equipment and the safety of equipment and its mission completion and use;

Whether the equipment can be effectively stored in the environment;

If there is mold growth, whether there is a simple removal method;

What are the effects of mold on the product: 

1. Direct attack on the material.

Non-mildew-resistant materials are susceptible to direct attack because molds can break down materials and use them as their own nutrients. 

This leads to cracking of the physical properties of the equipment. Non-mildew resistant materials are: natural materials and synthetic materials. 

2. Indirect attack on materials.

Mold tests can cause damage to electrical and electronic systems. Damage to optical systems is mainly caused by indirect erosion. Mold can have a negative impact on the transmission of light in optical systems, clogging precise moving parts, making dry surfaces wet and accompanied by a decline in performance.

Determination of test time: The short time of the general test is 28 days. Since the indirect erosion and physical effects of mold growth on the test piece are unlikely to occur in a shorter test time, if it is required to improve the certainty or reduce the risk in determining the effects of mold growth on the test piece, the test time shall be extended to 84 days. 

Strain selection for mold test:

Aspergillus niger, Aspergillus terreus, Paecilomyces varioti, Penicillium hauvianum, Scopulariopsis brevicaulis, Trichoderma viride, Aspergillus flavus, Aspergillus versicolor, Penicillium sp.and Chaetomium globosum. Aspergillus niger.

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