Higher strength faster than silicone curing glue _ENIENT reactive hot melt glue to solve your bonding problem-Products-Manufacturer of Neutral Rust Remover_Quick & Mild Metal Rust Removal Technology _ ENIENT CHEM CO.,LTD
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Higher strength faster than silicone curing glue _ENIENT reactive hot melt glue to solve your bonding problem

AddTime:2023-03-12 Hits:834

 Higher strength faster than silicone curing glue _ENIENT reactive hot melt glue to solve your bonding problem

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 Silicone adhesive is a kind of thermosetting synthetic rubber with extremely complex structure, which belongs to the polymer adhesive, with strong flexibility, high temperature resistance, acid and alkali resistance, corrosion resistance, hydrolysis resistance and other properties. Often used in insulation materials, low density polyester, molded rubber, plastic, metal, glass and other materials between the bonding fixed, can also be used for decorative bonding, with excellent bonding and tensile and compression resistance. Silicone adhesive characteristics: 1, silicone adhesive has high molecular weight, strong high temperature resistance, corrosion resistance, hydrolysis resistance, oil resistance, aging resistance, UV resistance, UV resistance and other characteristics.2, silicone adhesive has a strong bonding force, can achieve a better bonding effect, and its adhesion can last for a long time.3, silicone adhesive can resist low temperature environment, can be used normally in low temperature environment, will not lose adhesion because of low temperature.4, silicone adhesive can resist the corrosion of various chemical solvents, with corrosion resistance, can be used in the environment of various chemical solvents.5, silicone adhesive has good filling, can well fill the burrs of low density material, make the bonding layer more stable.

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But the silicone adhesive also has the shear, the tensile strength is not high, itself is more soft and easy to be destroyed, has a long curing time and other disadvantages. As a result, it cannot be used on a large scale under the conditions of requiring high strength and high efficiency. ENIENT Reactive hot melt adhesive can not only replace the silicone adhesive for fixed sealing dust and other purposes, curing time will be greatly accelerated, the initial curing of five minutes can have a high bonding strength, without pressure, very suitable for high efficiency of modern mechanized production. And has a high bonding strength, for most plastic materials, such as PC, ABS, PA, POM, etc., most metal materials, such as iron, aluminum, copper and so on can do structural bonding. No need for traditional structural processes such as screw buckle, which greatly optimizes the production process, saves the production time and improves the production efficiency. And ENIENT reactive hot melt glue also has a certain elasticity, has a certain buffer effect for stress. And it can stick different kinds of materials together at the appropriate temperature and can be maintained for a long time, which makes it particularly suitable for the electronics industry, packaging industry, construction industry and other fields.




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ENIENT ® products are the key to a clean and safe working environment across a wide range of industries. Our innovative and reliable super-safe rust remover delivers uncompromising performance, making rust removal a very simple job. Our rust remover can be easily applied to scenes that need rust removal. It can replace refrigerant and rust removal oil, making rust removal easier and eliminating additional rust removal processes. 


We ensure that you have easy access to technical information and resources to identify the right product for your specific application, sector and industry. We offer comprehensive support to let you know more about our innovative rust removal solutions and how they can help you. 


For more information about the product, CONTACT ENIENT CHEM and consult to one of our technical advisors. Browse our product range and download technical datasheets to learn more about the specific performance, compatibility, and application of each descaling scenario.


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