AddTime:2023-03-12 Hits:834
Curing fast strength of high electronic assembly glue _ENIENT reactive hot melt glue to solve your bonding problem
The adhesives used in electronic assembly mainly include: 1, hot melt adhesive: hot melt adhesive is a soft solid composed of various polymers and stabilizers. It is a solid state at room temperature, But upon heating it up to a certain temperature, It will melt into a liquid, And can form a seamless sealing layer; 2, glue: glue refers to those who can be painted to the surface of the adhesive, Common latex, water-based latex, water-based adhesive, hot melt glue and hot melt glue, etc.; 3, spray glue: spray glue refers to the adhesive spray to glue on the surface of a method, Commonly used hot melt adhesive, water-based latex and latex, etc.; 4, plastic adhesive: plastic adhesive is a mixture of adhesive materials and filling materials, It is characterized by plastic processing, Can be of any shape as needed, Commonly used silica gel, hot melt glue and latex; 5, hot melt: hot melt is the use of hot melt glue to combine different materials together of a bonding way, Commonly used are hot melt gel, silica gel and latex.
Advantages of reactive hot melt adhesive in the electronic assembly industry Just need to adjust the temperature, Simple operation; 2. The melting point temperature of hot melting adhesive is relatively low, The melting point temperature is generally below 120℃, Will not damage the electronic components; 3. Hot melt adhesive has good flexibility and elasticity, Ability to hold the electronic components tightly, At the same time does not affect the heat dissipation of electronic components; 4. Good adsorption of hot melt adhesive, Aable to effectively anchor electronic components to the substrate, And not easy to fall off; 5. Hot melt adhesive has good heat resistance, Can withstand a certain temperature, Therefore not susceptible to thermal damage; 6. Hot melt adhesive has good chemical resistance, Can withstand a certain amount of chemical corrosion, Can prevent the electronic components from being damaged by the chemical action.
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